The Techniques and Challenges of IEC 61850-3 Certification
The three main requirements for embedded computers to be IEC 61850-3 compliant are:
Solid EMC design for electromagnetic interference protection
If subjected to a 4 KV electromagnetic current, for example, to begin with the voltage is stepped down to 75 V, and then current limitation is used to isolate both the high voltage and current. Next, the voltage is stepped down a second time to 12 V. A solid EMC design, such as ours, offers devices full protection from electromagnetic interference.
Note:
GDT = Gas Discharge Tube
PTC = Positive Temperature Coefficient (of Resistance)
TVS = Transient Voltage Suppressor
Wide operating temperature range
To endure harsh environments and
ensure optimal operating performance, even at high temperatures,
Moxa introduced its patented L-type™ heat sink. The
L-type™ heat sink is a heat dissipation mechanism that
cools down the unit's internal temperature, and works
by placing a plate in direct contact with the chief
heat source inside the unit.
Vibration and shock protection
Protected from 50G shocks
Protected from 5 to 500 Hz of vibration
6-side, 25-cm drop test under "normal"
working conditions
IEC 61850-3 and IEEE 1613 Embedded Computers
Are the Best Fit for Substations
Both IEC 61850-3 and IEEE 1613 define the highest standard of EMI immunity and error free communication requirements for equipment used in substations. Due to the nature of substation environments, it is imperative that all hardware used in the system is highly functional and reliable. This also applies to embedded computers, which must perform consistently for both front-end computing and backbone hosting. As a leading manufacturer of industrial grade embedded computers, Moxa has a vast selection of products that are IEC 61850-3 certified.
