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Long-Term Durability

Absolutely Reliable in Temperature Extremes

An industrial computer’s reliability is built upon many critical factors. One of the major challenges faced by manufacturers is providing a rugged fanless computer that meets the wide temperature tolerance demands of industrial grade applications. A fanless design is desirable because it reduces size, complexity, susceptibility to dust, and wear and tear.

Moxa has a long track record of investing heavily in research and development of the high quality materials, innovative technologies, and sophisticated manufacturing facilities that are required to make fanless industrial-grade computers work reliably at extreme temperature ranges from -40 to 75°C. By combining this expertise with a rigorous testing process, Moxa has become renowned for durable, reliable products.

Component placement and selection

A fanless design presents many challenges for developers of wide temperature tolerance computing products. Not only do the components themselves need to withstand a wide range of temperatures, but their positioning must also be adjusted to optimize heat dissipation. Instead of taking shortcuts by using cheaper or problematic components, Moxa selects parts that can offer continuous high performance with less heat output. The result is a more stable, reliable, and cost effective system that dramatically reduces total cost of ownership. Using reliable wide-temperature components is the most effective way to produce wide-temperature computers. To make it easier to find and deploy such components, Moxa’s hardware and layout designers maintain a database of components that meet the rugged requirements of all environments, from the extremely hot to the extremely cold.

FloTHERM simulation increases reliability

To assure success, Moxa engineers use the powerful FloTHERM CFD analysis software for advanced analysis of each component and how its placement affects the system as a whole. The device’s thermal profile is built up step by step, ensuring that the target parameters and requirements are met, and the design will deliver the desired results. After the design and modeling analysis has been completed, a pilot device is produced and subjected to a long regimen of tests in thermal chambers, taking it between extremes of cold and heat over varying periods of time and at varying rates of change.

System-wide LTE module heat dispatch

At Moxa we are always improving our thermal technology in order to meet customer’s needs, make use of the latest tools, processes and materials, and stay at the forefront of the industry. There is booming demand for 4G LTE-enabled computing platforms, accelerated by the growing popularity of the Industrial IoT (Internet of Things) concept. However, the LTE-enabled computing platform’s thermal design has become a big new challenge for industrial computer designers. LTE networks increase wireless connectivity speed up to ten times compared to the previous generation. However, this improvement brings with it a disadvantage: the extra heat generated by LTE components. To ease customers’ concerns and provide worry-free Industrial IoT computing platforms, Moxa considers the impact of the LTE module in its System View design process. This ensures that our wireless-enabled industrial computers can work just as reliably as our other wide-temperature industrial computers, making them a perfect option for the newest industrial IoT applications.

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