Brea, California, November 21, 2018—Moxa Inc., a leader in industrial communications and networking, today announced it will be showcasing its expertise in Time-Sensitive Networking(TSN) technology at SPS IPC Drives 2018, giving attendees a glimpse of how standard Ethernet with TSN technology enables the exchange of all data in automation architectures in parallel or vertically in real time and with deterministic low latency, thereby unlocking the possibilities of the Industrial Internet of Things (IIoT) and Industry 4.0.
The vision of TSN technology is to deliver critical data to the right place at the right time in a converged and large-scale IIoT network, realizing the dream of mass customization for the manufacturing industry while going beyond reducing overall costs in order to change production on the fly. Moxa will demonstrate use cases in a unified, standard Ethernet infrastructure with guaranteed Quality of Service and deterministic low-latency environments at its booth (Hall 9, Booth 231), including in-machine-to-supervisory real-time communication, machine-to-machine real-time communication, and in-machine latency-guaranteed communication based on standard Ethernet.
Moxa will also participate through various technology and standard groups, such as Edge Computing Consortium (ECC), Industrial Internet Consortium (IIC), Labs Network Industry 4.0 (LNI 4.0) and Ethernet POWERLINK Standardization Group (EPSG), in interoperability demonstrations at the trade show. All the demonstrations showcase the interoperability of Moxa’s TSN switches with other vendors’ devices in one standard Ethernet-based network infrastructure that can build the future of industrial automation and open up the possibilities brought by the IIoT and Industry 4.0.
“To evolve transformative technologies that can benefit businesses and society as a whole, Moxa has been ambitiously collaborating with key industry players to drive innovations, industry standards, proof of concepts, testbeds, and the successful commercialization of the technology compliant to constantly evolving standards to meet perpetual growth in demand for connectivity and bandwidth,” said Andy Cheng, President of the Strategic Business Unit at Moxa.
As part of its ongoing commitment to building innovative industrial connectivity technologies and solutions, Moxa has been actively participating in three of the world’s most significant TSN interoperability testbeds built by ECC, IIC and LNI 4.0 respectively. Through these activities in the testbeds, Moxa can rigorously test TSN interoperability and ensure that the developing implementation is stable and reliable before going to market.
"We are excited to have the industrial Ethernet and networking expertise that Moxa brings to the TSN community,” said Todd Walter, Host of Americas IIC TSN Testbed and Chief Marketing Manager at National Instruments. “Our customers need an open and interoperable ecosystem of TSN-enabled devices. The investments and participation from Moxa in activities such as the IIC TSN for Flexible Manufacturing Testbed will help ensure Ethernet switch interoperability.”
"Moxa as a partner to EPSG brings very valuable knowledge and great products for the vast OPC UA TSN ecosystem, covering all the way from sensors to the cloud,” said Stefan Schönegger, General Manager of Ethernet POWERLINK Standardization Group (EPSG) and Vice President of Product Strategy & Innovation at B&R Industrial Automation. “At this year’s SPS, Moxa is participating in our joint demonstration that open and standardized protocols and OPC UA TSN come together to create open network infrastructure for real-time communication in the IIoT while leveraging the cost benefits of standard Ethernet hardware.”
Besides providing TSN demonstrations at its booth (Hall 9, Booth 231), Moxa will also participate in the joint demonstrations with the leading organizations listed below throughout the show floor.
- Edge Computing Consortium (ECC) OPC UA TSN Testbed at Fraunhofer (Hall 6, Booth143) -
- Ethernet POWERLINK Standardization Group (EPSG) (Hall 5, Booth 306)
- EtherCAT Technology Group (ETG) (Hall 5, Booth 310)
- Industrial Internet Consortium (IIC) Testbed (Hall 6, Booth 360)
- Labs Network Industrie 4.0 Testbed at OPC Foundation (Hall 5, Booth 347)
- Joint demo by Intel, KUKA, TTTech and Moxa at Intel (Hall 5, Booth 350)